Reducing I2R losses to enable extended missions
Learn how Vicor delivers high power with efficiency and reduced weight for electronic countermeasures
MI-ComPAC™ DC power supply
The
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and Benefits
One, two or three outputs
MIL‑STD-461C/D/E
MIL‑STD‑704A‑F, 1275A/B/D and DO‑160E compliance for transients
Resources
Resources for the design engineer
Supporting more functionality, increased payload and longer run time
Learn how Vicor delivers high power with efficiency and reduced weight that allows for greater payload options to support mission success
Efficiently powering the growing suite of advanced on-board sensors
Learn how Vicor delivers high power with efficiency and reduced weight air-to-surface (ASM) missiles
Compact, efficient power solutions enable improved countermeasure capabilities
Explore Vicor's efficient and reduced weight power delivery network for electronic warfare countermeasures systems
- VI-200, VI-J00 Design Guide and Applications Manual
- VI-200, VI-J00 Design Guide and Applications Manual
- 1. Zero-Current Switching
- 1. Zero-Current Switching
- 2. DC-DC Converter Pinouts
- 3. Module Dos and Donts
- 4. Overcurrent Protection
- 5. Output Voltage Trimming
- 6. Multiple Gate In Connections
- 7. Applications Circuits / Converter Array Design Considerations
- 8. Using Boosters and Parallel Arrays
- 9. EMC Considerations
- 10. Optional Output Filters
- 11. Battery Charger (BatMod)
- 12. AC Input Module (AIM / MI-AIM)
- 12. AC Input Module (AIM / MI-AIM)
- 13. Harmonic Attenuator Module (HAM)
- 14. Input Attenuator Module (IAM / MI-IAM)
- 15. Ripple Attenuator Module (RAM / MI-RAM)
- 16. Offline Front End
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 17. DC Input Power System (ComPAC / MI-ComPAC Family)
- 18. AC Input Power System (FlatPAC Family)
- 19. AC Input Power System (PFC FlatPAC)
- 20. Thermal and Module Mounting Considerations
- 20. Thermal and Module Mounting Considerations
- 21. Thermal Curves
- 22. Lead Free Pins (RoHS)
- 23. Tin Lead Pins
- 24. Module Packaging Options (SlimMod, FinMod, BusMod and MegaMod Families)
- 25. Product Weights
- 26. Glossary of Technical Terms
- Outline Drawing for ComPAC, "L" Configuration (Single)
PDF DXF - Outline Drawing for ComPAC, "M" Configuration (Dual)
PDF DXF - Outline Drawing for ComPAC, "N" Configuration (Triple)
PDF - Outliine Drawing for ComPAC, "N" Configuration (Triple)
DXF - Outline Drawing for ComPAC, "P" Configuration (Dual)
PDF DXF - Outline Drawing for ComPAC, "Q" Configuration (Triple)
PDF DXF - Outline Drawing for ComPAC, "R" Configuration (Triple)
PDF DXF - Outline Drawing for ComPAC, "L" Configuration (Single) -CC*
PDF - Outline Drawing for ComPAC, "L" Configuration (Single) -CC*
DXF - Outline Drawing for ComPAC, "P" Configuration (Dual) -CC*
PDF DXF - Outline Drawing for ComPAC, "M" Configuration (Dual) -CC*
PDF DXF - Outline Drawing for ComPAC, "Q" Configuration (Triple) -CC*
PDF - Outline Drawing for ComPAC, "Q" Configuration (Triple) -CC* »
DXF - Outline Drawing for ComPAC, "R" Configuration (Triple) -CC*
PDF DXF - Outline Drawing for ComPAC, "N" Configuration (Triple) -CC*
PDF DXF
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