Achieving higher power density with good-old Si MOSFETs
Minimizing tradeoffs and workarounds using high voltages and modular power approach to power systems design give longevity to the Si MOSFET
NBM™ Non-isolated Bus Converter Module
Bidirectional power converters
NBMs are fixed ratio (non-regulating) non-isolated, bidirectional DC-DC converters. These patented high-performance power modules provide a complete DC-DC solution and do not require an external input filter or bulk capacitors. In addition, the NBM2317 features built-in hot-swap capability and inrush current limiting. Fast transient response is supported by the NBM’s low output impedance. The NBM family of converters are available in through-hole Converter housed in Package (ChiP™) and Surface Mount (SM-ChiP™) board-mount packages. All manufacturing is performed in the Vicor state-of-the-art ChiP™ fab located in Andover, Massachusetts.
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| Part Number | Datasheet | Input (V) | Output (V) | Output Current (A) | K Factor | Control Interface | Max Capacitance | Mounting | Temperature | Dimensions mm | Dimensions in. | Package | Add to cart / view details | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Number: | Input (V): 40.0 - 60.0 |
Output (V): 10.0 - 15.0 |
Output Current (A): 65.0 |
K Factor: 1/4 |
Control Interface: Analog |
Max Capacitance: 3000 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.80 x 17.30 x 5.20mm |
Dimensions in.: 0.90 x 0.68 x 0.20in |
Package: 2317 SM-ChiP |
View Details | ||
| Part Number: | Input (V): 40.0 - 60.0 |
Output (V): 10.0 - 15.0 |
Output Current (A): 80.0 |
K Factor: 1/4 |
Control Interface: Analog |
Max Capacitance: 3000 |
Mounting: Surface Mount |
Temperature: -40 to +125°C |
Dimensions mm: 22.80 x 17.30 x 5.20mm |
Dimensions in.: 0.90 x 0.68 x 0.20in |
Package: 2317 SM-ChiP |
View Details | ||
| Part Number: | Input (V): 36.0 - 46.0 |
Output (V): 12.0 - 15.3 |
Output Current (A): 160.0 |
K Factor: 1/3 |
Control Interface: Analog |
Max Capacitance: 3000 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 61.00 x 25.14 x 7.21mm |
Dimensions in.: 2.40 x 0.99 x 0.28in |
Package: 6123 ChiP |
View Details | ||
| Part Number: | Input (V): 36.0 - 46.0 |
Output (V): 12.0 - 15.3 |
Output Current (A): 160.0 |
K Factor: 1/3 |
Control Interface: Analog |
Max Capacitance: 3000 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 61.00 x 25.14 x 7.21mm |
Dimensions in.: 2.40 x 0.99 x 0.28in |
Package: 6123 ChiP |
View Details | ||
| Part Number: | Input (V): 36.0 - 60.0 |
Output (V): 7.2 - 12.0 |
Output Current (A): 170.0 |
K Factor: 1/5 |
Control Interface: Analog |
Max Capacitance: 3000 |
Mounting: Through Hole |
Temperature: -40 to +125°C |
Dimensions mm: 61.00 x 25.14 x 7.21mm |
Dimensions in.: 2.40 x 0.99 x 0.28in |
Package: 6123 ChiP |
View Details | ||
Power System Designer
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Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and benefits
High efficiency >98%
High power density of up to 3,600W/in3
Parallel operation for multi‑kW arrays
Bidirectional capability
Watch the Digi-Key video that outlines the technical advantages of the NBM2317
Resources
Resources for the design engineer
Preparing the way ahead for a compatible EV infrastructure
Onboard conversion enables EVs to charge any station
Eliminate the 12V battery and increase EV performance
Vicor power module transient response (75A/10µs), is three times faster than 12V, in essence creating a virtual battery
Modular power delivery networks for UAVs
The key challenge we see facing engineers today is the demand for smaller, lighter-weight designs that deliver higher power
- AN:001 – Configuring the Vicor BCM with Low Power niPOLs
- AN:016 – Using BCM Bus Converters in High Power Arrary
- AN:031 – Through-Hole ChiP Package Soldering Guidelines
- AN:036 – Recommendations for Maximum Compressive Force of Heat Sinks
- AN:039 – Thermal Management for VIA and ChiP Modules
- AN:701 – SM-ChiP™Reflow Soldering Recommendations
6123 ChiP
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
For California residents see information regarding California Proposition 65
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