Current Multiplier Technology Advances Enable New AI Processor Power Solutions

Presented by Siyu Chai, Product Manager Global AI/Computing Market, Vicor

Watch the full presentation video and download the presentation deck

Leveraging a Factorized Power Architecture (FPA) and current multiplication, Vicor provides solutions for lateral power delivery, vertical power delivery and a new solution, lateral-vertical power delivery. Siyu addressed the problem of impedances and their effects on PDN losses in relation to the processor core voltages. Advances in power module packaging, next generation current multiplication and current density was also be addressed. These technologies enable wafer scale and clustered computing AI systems with current requirements in the tens of thousands of amps and will unleash xPU performance. The presentation deck is available to download.

Ms. Chai has served in her current role since September, 2021 as a Product Manager for global AI/computing market. Ms. Chai served as Business Development Engineer in EMEA from 2018 to 2021. Prior to joining Vicor, Ms. Chai served as a power electronics engineer in the automotive industry for powertrain system integration of DC/DC converter and on-board charger. She holds a M.S. in Electrical Engineering from Politecnico di Milano (Polytechnic of Milan) in Italy, and she worked as a guest researcher at University of Aachen in Germany for automated power system. schai@vicorpower.com