Achieving higher power density with good-old Si MOSFETs
Minimizing tradeoffs and workarounds using high voltages and modular power approach to power systems design give longevity to the Si MOSFET
NBM™ Non-isolated Bus Converter Module
Bidirectional power converters
NBMs are fixed ratio (non-regulating) non-isolated, bidirectional DC-DC converters. These patented high-performance power modules provide a complete DC-DC solution and do not require an external input filter or bulk capacitors. In addition, the NBM2317 features built-in hot-swap capability and inrush current limiting. Fast transient response is supported by the NBM’s low output impedance. The NBM family of converters are available in through-hole Converter housed in Package (ChiP™) and Surface Mount (SM-ChiP™) board-mount packages. All manufacturing is performed in the Vicor state-of-the-art ChiP™ fab located in Andover, Massachusetts.
Power System Designer
Quick product searchWatch demo video
Output
Min output:
Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Features and Benefits
Features and benefits
High efficiency >98%
High power density of up to 3,600W/in3
Parallel operation for multi‑kW arrays
Bidirectional capability
Watch the Digi-Key video that outlines the technical advantages of the NBM2317
Resources
Resources for the design engineer
Eliminate the 12V battery and increase EV performance
Vicor power module transient response (75A/10µs), is three times faster than 12V, in essence creating a virtual battery
Preparing the way ahead for a compatible EV infrastructure
Onboard conversion enables EVs to charge any station
Modular power delivery networks for UAVs
The key challenge we see facing engineers today is the demand for smaller, lighter-weight designs that deliver higher power
- AN:001 – Configuring the Vicor BCM with Low Power niPOLs
- AN:016 – Using BCM Bus Converters in High Power Arrary
- AN:031 – Through-Hole ChiP Package Soldering Guidelines
- AN:036 – Recommendations for Maximum Compressive Force of Heat Sinks
- AN:039 – Thermal Management for VIA and ChiP Modules
- AN:701 – SM-ChiP™Reflow Soldering Recommendations
6123 ChiP
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CB Certificate – IEC 60950-1
- cTÜVus – EN 62368-1, UL 62368-1, CSA 62368-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 62368-1
For California residents see information regarding California Proposition 65
Promo Component
Get more documents, videos and case studies in the resource library for engineers